Self-Supervised Attention-Based Virtual Metrology for CMP MRR Prediction
Jonathan Adam Rico, Nagarajan Raghavan, Senthilnath Jayavelu
原文摘要
Chemical mechanical planarization (CMP) is a critical semiconductor manufacturing process where material removal rate (MRR) is a key metric for process monitoring and advanced process control (APC). Virtual metrology enables MRR estimation from process time series signals, supporting run-to-run(R2R) control and process optimization while reducing reliance on physical metrology. Existing approaches typically rely on simplified linear assumptions or require handcrafted feature engineering. In this paper, we propose Global Regression Pretraining(GREP), a self-supervised, attention-based framework for CMP MRR prediction. GREP learns temporal representations from unlabeled sensor signals through global proxy-target regression, followed by supervised fine-tuning for MRR estimation. The framework is evaluated against a feature-engineered supervised baseline under three conditions: limited labeled data, sensor noise, and temporal process drift. Experiments on the PHM 2016 CMP dataset demonstrate competitive performance under limited labeled-data conditions, with improvements in selected cases and performance largely comparable to the baseline across different labeled-data fractions. Both models exhibit relatively small changes in prediction error with increasing noise, while GREP achieves a 17.0% RMSE reduction in the final temporal interval.
cs.LG · cs.AI